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Application Notes  |
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Ball Bumping
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PDF Document
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135.97 KB
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F&K DELVOTEC MODEL 6200 with Linear Z drive is currently running in
production Ball Bumping on wafers and on Disk Drive Devices (Sliders). This
Applications Notes covers both types. |
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Fine Pitch Large Wire Bonding
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PDF Document
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101.61 KB
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Application Notes for Large Wire bonding for Power
Devices |
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Microwave Device Bonding
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PDF Document
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68.74 KB
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Application Notes for Microwave Device Bonding. |
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RF Device Bonding
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PDF Document
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133.20 KB
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Application Notes for bonding of Radio Frequency Devices(RF) |
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Ribbon & Deep Access Bonding
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PDF Document
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150.13 KB
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Application Notes for Ribbon & Deep Access Bonding. |
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Document Library |
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[Article 1] Zero-Defect Production |
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PDF Document
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270.73 KB
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Every year, around 60 million cars are produced world-wide, most of which are fitted with anti-collision airbag systems. None of these airbags must fail when activated, and this requires a zero-defect production. Moreover, the systems have to have a lifetime of 15 years or more which means they have to have extremely high long-term stability. |
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[Article 2] Post-Bond Inspection of Wire Bonds |
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PDF Document
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187.39 KB
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As discussed in the first paper of the series, it has long been a wish of quality inspectors and production managers alike to inspect 100% of bonded wires non-destructively. Unfortunately, no universally useable equipment was available up to now. F&K Delvotec is the first supplier to offer a sophisticated post-bond inspection system which will be described further in this paper. |
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[Article 3] Post-Bond Inspection of Die Bonds |
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PDF Document
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673.79 KB
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As described in the previous paper, non-destructive 100% inspection is desirable for the direct
mounting of dies on PCBs. Compared to die-packaging on standard materials such as leadframes
or ceramic packages, substrate materials like circuit boards, thin- and thick-film ceramics or premolded
packages present a large number of potential problem areas which can be caused by
variation in the surface properties. |
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[Article 4] Bond Process Control of Wire Bonds |
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PDF Document
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340.02 KB
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Faced with the demand of ever decreasing defect rates developments in wire bonding technology
have been aimed at two problem areas:
- how can the bond process be controlled to ensure optimised bonds of constant quality?
- how can the bond quality be monitored and documented, reliably and non-destructively?
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[Article 5] Impedance Check for Wire-Bonding |
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PDF Document
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249.97 KB
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The preceding paper (part 4 of the series about approaches to Zero Defect Production) contained
a detailed description of the patented Bond Process Control (BPC) system. It monitors and regulates
the amount of ultrasonic energy applied to the bond by following the wire deformation while
bonding, because the small variations in surface properties require different optimum ultrasonic
energy. This improves the bond results. |
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Bond Process Control, BPC |
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PDF Document
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170.02 KB
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This article provides a short description of the
physical processes which occur during wire
bonding and then goes on to describe the Bond
Process Control Unit (BPC) developed by F&K
Delvotec. The BPC is the only commercially available unit for on-line control
of the bond process and is being used successfully
around the world, in particular for
aluminum wedge bonding. The BPC features
have been expanded recently to include statistical
processing capability making it an invaluable
tool for efficient monitoring and control of the
manufacturing process. The first section explains
why bond process control is required and how it
operates, the second section describes the
statistical evaluation of the bond data which are
collected for every bond. |
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Chip on board Technology |
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PDF Document
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494.73 KB
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After many years of development, hybrid and chip-on-board or COB technology has reached the stage where con-siderable savings in space and cost are achievable. This article reviews the most import-ant features of these technologies, together with the manufacturing equipment necessary for their practical use. |
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Evaluation of heavy wire bond tools with ceramic tip technology |
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PDF Document
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162.88 KB
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F&K Physiktechnik GmbH, Potsdam – Germany, develops and offers test and measurement equipment to characterize the ultrasonic components of wire and flip chip die bonders for microelectronic production. |
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Monolithic Millimeter Wave Integrated Circuits |
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PDF Document
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542.51 KB
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Monolithic Millimetre Wave Integrated Circuits (M³IC's) have been developed all over the world in the past few years. Using these circuits the cost of millimetre wave instrumentation can be reduced to the level where it becomes attractive for transportation, communication, environmental and industrial sensor technology applications. |
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Wire Bonding SAW Filters |
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PDF Document
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62.34 KB
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Often taken for granted, a closer look at the Lithium and Quartz SAW filters produced by
Siemens + Matsushita in Munich reveals a very high-tech product with the real know-how in
the area of packaging rather than chip design. This article will show how modern rotary
head bonders capitalize on this know-how. |
