F&K Delvotec is the only manufacturer supplying machines covering the complete spectrum of wire bonding technologies: gold ball bonding, gold ball bumping, wedge bonding for fine gold, aluminium wire and ribbon, wedge bonding for power devices with heavy aluminium wire. There are a number of variations within these categories, e.g. bond heads for high frequency components or ribbon bonding, and low EMI/ESD configurations. The base for all machines is identical, only the bond head changes.
