September 7, 2010
 
 
Awards and Patents
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Our Awards and Certificates


Delvotec's consistent orientation towards the demands of our customers is the key to success.

All the patents and award received over the past years are proof of this commitment.


Customer oriented development creates exceptional solutions.

10 Best Urkunde Supplier of the Year Award Editor's Choice of Best Product
     
ISO 9001 Zertifikat Editor's Best Choice Award Entrepreneur of the Year Award
     
 
 
 
 
 
 
 
Overview of the F&K Delvotec Patents


Bonding is a science of its own and hence an intellectual challenge for the gifted engineer. Technological leadership shows itself in the way that processes of enormous complexity are analyzed and ideas are translated into manageable technological solutions. The over 30 patents granted and applied for demonstrate our impressive position in bonding technology. Some of the most important are:

 
Bonding Head

Country: USA
Date: 11/1/1988
Patent Number: 4,781,319

 
Ball-Bondverfahren und Vorrichtung zur Durchführung derselben

Country: Europe
Date: 6/1/1994
Patent Number: 299987

 
Ball-Bondverfahren und Vorrichtung zur Durchführung desselben

Country: Europe
Date: 3/31/1999
Patent Number: 533164

 
Ball Bonding Method and Apparatus for Performing the Method

Country: USA
Date: 5/15/1990
Patent Number: 4925083

 
Vorrichtung und Verfahren zur gesteuerten Zuführung eines Bonddrahtes zum Wedge oder zur Kapillare eines Bondkopfs

Country: Europe
Date: 8/3/1994
Patent Number: 330053

 
Apparatus and Method of Controlled Feed of a Bonding Wire to the "Wedge" of a Bonding Head

Country: USA
Date: 5/29/1990
Patent Number: 4,928,871

 
Device for Monitoring Wire Supply and Consumption

Country: Europe
Date: 9/10/1997
Patent Number: 447085

 
Device for Monitoring Wire Supply and Consumption

Country: USA
Date: 1/11/1994
Patent Number: 5,277,354

 
Bonding Wedge

Country: USA
Date: 5/28/1991
Patent Number: 5,018,658

 
Bondstempel

Country: Germany
Date: 8/21/1997
Patent Number: 3912580

 
Bondkapillare sowie Verfahren zum Bonden unter Verwendung einer derartigen Bondkapillare

Country: Germany
Date: 7/16/1987
Patent Number: 3537551

 
Die Eject System for Die Bonder

Country: Europe
Date: 9/20/1995
Patent Number: 447083

 
Control System

Country: Europe
Date: 1/15/1997
Patent Number: 540189

 
Wire Bonding Ultrasonic Control System Responsive to Wire Deformation

Country: USA
Date: 5/24/1994
Patent Number: 5,314,105

 
Control System

Country: UK
Date: 3/22/1995
Patent Number: 2270868B

 
Reflow Soldering Control Process

Country: UK
Date: 6/7/1995
Patent Number: 2271305B

 
Tape Automated Bonding Control System

Country: UK
Date: 6/7/1995
Patent Number: 2271306B

 
Tool Exchange System for Hybrid Die Bonder

Country: Europe
Date: 6/12/1996
Patent Number: 447087

 
Tool Exchange System for Hybrid Die Bonder

Country: Europe
Date: 5/15/1996
Patent Number: 494510

 
Gebrauchsmuster "Vorrichtung zum Ballbonden"

Country: Germany
Date: 9/19/1996
Patent Number: 29608277.5

 
Bonding Head

Country: USA
Date: 12/15/1992
Patent Number: 5,170,928

 
Vorrichtung und Verfahren zum Drahtbonden

Country: Europe
Date: 3/26/1997
Patent Number: 649701

 
Bondkopf für Ultraschall-Bonden

Country: Germany
Date: 2/17/2000
Patent Number: 4326478

 
Bonding Head for an Ultrasonic Bonding Machine

Country: USA
Date: 9/26/1995
Patent Number: 5,452,838

 
Wire Guide for a Bonding Machine

Country: USA
Date: 5/25/1999
Patent Number: 5,906,706

 
Bonding Head

Country: Europe
Date: 9/16/1998
Patent Number: 864392

 
Bonding Head

Country: USA
Date: 9/14/1999
Patent Number: 5,950,903

 
Bonding Head

Country: Europe
Date: 8/12/1998
Patent Number: 857535

 
Ultrasonic Bonding Head Comprising a Linear Motor for Adjusting the Pressure According to a Piezo Detector

Country: USA
Date: 11/9/1999
Patent Number: 5,979,737

 
Apparatus for Manual Wire Bonding

Country: USA
Date: 11/7/1989
Patent Number: 4,878,609

 
Vorrichtung zum Drahtbonden

Country: Germany
Date: 6/1/1988
Patent Number: 3616651

 
Vorrichtung zum manuellen Drahtbonden

Country: Europe
Date: 5/15/1987
Patent Number: 267249

 
Control System

Country: Japan
Date: 2/8/2002
Patent Number: 3276421

 
Vorrichtung zum Ball-Bonden

Country: Europe
Date: 9/4/2002
Patent Number: 804994

 
Gebrauchsmuster "Vorrichtung und Verfahren zum Drahtbonden"

Country: Germany
Date: 1/16/1997
Patent Number: 9321269.0

 
Wire Guide for a Bonding Machine

Country: Europe
Date: 1/9/2002
Patent Number: 922524

 
Vorrichtung und Verfahren zum Thermokompressionsbonden

Country: Europe
Date: 3/27/2002
Patent Number: 947281

 
Bonding Head for a Wire Bonding Machine

Country: Europe
Date: 6/25/2003
Patent Number: 857535

 
     
Our Disclosure Specifications:
 
Vorrichtung zum Thermokompressionsbonden

Country:
Date:
Patent Number:

 
     
     
Further patents pending.
 
   
   
   
For additional information about our patents please contact:
     
USA: Said Kazemi
VP & Technical Director
Rick Bailey
General Manager
     
All other countries: Josef Sedlmair (PhD) 
Coordinator Sales & Marketing International
Philip Homami
Manager Sales & Marketing Europe


 
 
 
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