The user-programmable wedge-wedge bonder 5430 can process aluminium and gold wires from 17.5 to 75 µm diameter. The compact desk-top unit is ideal for laboratory, prototyping, preseries and repair applications. The stepping motor driven Y and Z axes enable single or multiple bonds to be executed reliably and repeatably under full programme control. Operators require only a minimum of training, making the 5430 the ideal choice for pre-series and small-scale production.
The highly flexible 5430 can be used for multiple applications and the bond head is easily exchangeable allowing technology mixes, e.g. deep access.