The user programmable model 5432 wedge-wedge bonder can process gold and aluminium wires from 17.5 to 75 µm diameter and ribbon from 30 to 200 µm width. For wire diameters under 25 µm and for all ribbons a motor driven wire feed option is available. The compact desk top machine is ideal for laboratory, prototyping and repair applications. The stepping motor driven Y and Z axes enable single or multiple bonds to be executed reliably and repeatably under full programme control. Operators require only a minimum of training making the 5432 the ideal choice for pre-series and small scale production lines.