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The semi-automatic Wedge-Wedge Bonder 5630 fills the gap between the manual Wedge- Bonders series 53xx and 54xx from F & KDelvotec Semiconductor to the automatic-Bonder from F & K Delvotec.
He is on basis 5600-series fully PC controlled and allows any number of bonds to be programmed. Pre-programmed adjust points are targeted through the camera's cross hair targeting system and the programmed bonds are executed automatically.
Two operating modes are available:
- Single bond for repair of various bond samples and making single bonds (manualautomatic) and
- multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).
The 5630 can also be used as Gold Wire or Alu Heavy Wire as well as pull-/shear tester by simply replacing the bond head and loading the appropriate software. Set-up time: approx. 5 minutes. Ask for information !
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