The semi-automatic Gold Ball-Bonder 5610 fills the gap be-tween the manual and semi-automatic Ball Bonder series 5410 and the fully automatic Ball Bonders from F&K Delvotec. The 5610 is fully PC controlled and allows any number of bonds and bumps to be programmed. Pre-programmed adjust points are targeted through the cam-era's cross hair targeting system and the programmed bonds or bumps are executed automati-cally. Two operating modes are available: Single bond for repair of various bond samples and making single bonds (manual-automatic) and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).

The 5610 can also be used as Thin Wire Wedge Wedge or Heavy Wire as well as pull-/shear tester by simply replacing the bond head and loading the appropriate software. Set-up time: approx. 5 minutes. Ask for information