F&K Delvotec is a respected technological leader in the field of Automated Assembly Equipment for the Microelectronic Industry.
Having started with the classic die attach and wire bonding technology, we are now offering the broadest range of bonding equipment with the latest state-of-the-art technology. We are specialized in serving the very demanding niche markets where automated processes could not otherwise find success because of either very high demands on quality or very low volumes. F&K Delvotec has had excellent success providing equipment for Automotive Sensors and very difficult to bond passive components such as SAW-Devices or Micromechanical Actuators for Magnetic Data Storage Devices. F&K Delvotec continues its leadership in automation on microwave, telecommunication, and opto-electronic applications.
The base for our equipment concept is a consistent platform strategy which would allow tailoring optimum custom solutions for any stage of production. We pay special attention to an easy and comfortable equipment implementation with pilot manufacturing leading to a fast and smooth transfer to volume production.
Our concept of offering a well designed complete solution has been extremely successful in this market. Since the company's new formation and re-organization in 1993, the number of employees has more than quadrupled and we have had a more than 700% business growth with an ever increasing customer base.
Our customers are mostly multinational companies entertaining similar production facilities in different continents, and so F&K Delvotec is a Global Company with offices and manufacturer's representatives worldwide.
